Best suited for CPUs with TDP of up to 65W |
CE and RoHs certified for guaranteed safety and reliability |
Each tube contains 1.5g of paste sufficient for 4-6 applications |
High thermal conductivity provides increased heat transfer to heat sink |
Ideal for multi-workstation setups, providing enough material for 20-30 total applications |
Ideal for servicing and maintaining desktop workstations and integrated chipsets with a heat sink |
Metal oxide-based compound works with a heat sink to improve heat dissipation from CPUs and GPUs |
Reliable performance in temperatures of -22F to 365F (-30C to 180C) with thermal conductivity of 3.07W/m K at 25 ?C or greater |
Re-sealable applicator syringe that prevents drying between use |
The compound contains 50% metal oxide and offers better thermal conductivity than standard heat pastes |