StarTech.com Thermal Paste Pack of 5 Re-sealable Syringes CPU Heat Sink Thermal Grease Paste
Product Code: 8ST10361329
Pack Of 1
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Description

General
This 5-Pack of thermal paste works with a heat sink to improve heat dissipation from integrated computer chips such as CPUs. The thermal paste features CE and RoHS certifications so you can rest assured it's safe for its intended use.

Reliable Performance
This thermal paste, also known as silver grease, is a metal-based compound that contains over 50% metal oxide to offer better thermal conductivity than standard heat transfer pastes. SILV5-THERMAL-PASTE performs reliability in temperatures of -22?F to 365?F (-30?C to 180?C) with thermal conductivity of 3.07 W/m-K at 25 ?C or greater. This performance makes the compound ideal for servicing & maintaining workstations, desktop computers and servers, and is best suited for CPUs with TDP of up to 65W

Resealable 1.5g Syringe Tubes
Each tube included in this five pack contains 1.5g of paste, sufficient for 4 to 6 applications, for 20 to 30 applications in total. Each unit is packaged in a syringe for easy application, that's re-sealable to prevent the product from drying between use. Plus, five included units make it ideal for distribution to different workstations throughout the work place.

SILV5-THERMAL-PASTE is backed by a StarTech.com 2-year warranty, including free lifetime 24/5 multi-lingual, North American based, technical assistance.

Specification

BrandStarTech.com
Dimensions20x67x20mm
ManufacturerStarTech.com
TypePCI Cards
Warranty2 Year Warranty
FormThermal Paste
Weight4g

Features

Best suited for CPUs with TDP of up to 65W
CE and RoHs certified for guaranteed safety and reliability
Each tube contains 1.5g of paste sufficient for 4-6 applications
High thermal conductivity provides increased heat transfer to heat sink
Ideal for multi-workstation setups, providing enough material for 20-30 total applications
Ideal for servicing and maintaining desktop workstations and integrated chipsets with a heat sink
Metal oxide-based compound works with a heat sink to improve heat dissipation from CPUs and GPUs
Reliable performance in temperatures of -22F to 365F (-30C to 180C) with thermal conductivity of 3.07W/m K at 25 ?C or greater
Re-sealable applicator syringe that prevents drying between use
The compound contains 50% metal oxide and offers better thermal conductivity than standard heat pastes

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